SMT Footprints
FIGURE A
Recommended copper heat speader drain pad footprint
W
Note: The thickness of
FIGURE B
Recommended heat sink solder mask opening
W 1
W 2
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
L
0.80
(0.030)
L
1.40
(0.060)
Part Number
573100
573300
573400
“L”
9.53 (0.375)
14.22 (0.560)
14.22 (0.560)
“W”
13.97 (0.550)
16.26 (0.640)
21.08 (0.830)
Part Number
573100
573300
573400
“L”
9.02 (0.355)
13.72 (0.540)
13.72 (0.540)
“W1”
13.46 (0.530)
15.75 (0.620)
20.57 (0.810)
“W2”
8.89 (0.350)
11.18 (0.440)
16.00 (0.630)
FIGURE C
Recommended copper pad size
for heat sink and device mounting footprint
10.41
(0.410)
15.49
FIGURE D
Recommended copper pad size
for heat sink and device mounting footprint
20.32
(0.800)
10.67
2.29
(0.090)
(0.610)
2.54
(0.100)
(0.420)
15.49
(0.610)
7.62
(0.300)
10.67
(0.420)
2.54
(0.100)
16.76
(0.660)
For D Pak (TO-263)
For MO-184 and SO-10
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
ASIA
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
26
www.aavidthermalloy.com
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